Materials and methods for stress reduction in semiconductor wafer passivation layers

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United States of America Patent

PATENT NO 8415812
APP PUB NO 20110049731A1
SERIAL NO

12874767

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Abstract

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The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.

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Patent Owner(s)

  • DESIGNER MOLECULES, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dershem, Stephen M San Diego, US 93 2967
Huneke, James T San Diego, US 9 150
Mizori, Farhad G San Diego, US 27 664

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