Multi-chip stack structure and signal transmission method thereof
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United States of America Patent
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Mar 20, 2012
Grant Date -
Mar 3, 2011
app pub date -
May 21, 2010
filing date -
Sep 1, 2009
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Abstract
A multi-chip stack structure and a signal transmission method are disclosed in specification and drawing, where the multi-chip stack structure includes first and second chips. The first chip includes a first inductance coil with a first series capacitor, and the second chip includes a second inductance coil with a second series capacitor. The first and second inductance coils are magnetically coupled to each other. The magnetically coupled inductance coils and the capacitors constitute a coupling filter.
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