Semiconductor device and manufacturing method therefor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8178972
APP PUB NO 20110057311A1
SERIAL NO

12948136

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Abstract

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A semiconductor device is obtained, in which excellent characteristics are achieved, the reliability is improved, and an SiC wafer can also be used for the fabrication. A plurality of Schottky-barrier-diode units 10 is formed on an SiC chip 9, and each of the units 10 has an external output electrode 4 independently of each other. Bumps 11 (the diameter is from several tens to several hundreds of μm) are formed only on the external output electrodes 4 of non-defective units among the units 10 formed on the SiC chip 9, meanwhile bumps are not formed on the external output electrodes 4 of defective units in which the withstand voltage is too low, or the leakage current is too much. Because the bumps are not formed on the defective units, Schottky-barrier-side electrodes 3 are connected in parallel to the exterior of the device through the bumps 11, and a wiring layer 13 and an external lead 13a of a wiring substrate 12; thus, only the external output electrodes 4 of the non-defective units 10 are connected in parallel with each other.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MITSUBISHI DENKI KABUSHIKI KAISHATOKYO6020

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yutani, Naoki Chiyoda-ku, JP 21 92

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
6281064 Method for providing dual work function doping and protective insulating cap 32 1999
 
CREE, INC. (1)
* 6514779 Large area silicon carbide devices and manufacturing methods therefor 13 2001
 
FREESCALE SEMICONDUCTOR, INC. (1)
5597737 Method for testing and burning-in a semiconductor wafer 34 1995
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (1)
6075279 Semiconductor device 9 1997
 
RENESAS ELECTRONICS CORPORATION (1)
6213356 Bump forming apparatus and bump forming method 20 1999
 
TEXAS INSTRUMENTS INCORPORATED (1)
2005/0151,268 Wafer-level assembly method for chip-size devices having flipped chips 19 2004
 
KABUSHIKI KAISHA TOSHIBA (1)
6392143 Flexible package having very thin semiconductor chip, module and multi chip module (MCM) assembled by the package, and method for manufacturing the same 51 2000
 
FUJITSU LIMITED (2)
* 5726492 Semiconductor module including vertically mounted semiconductor chips 30 1996
2002/0102,832 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 4 2000
 
HITACHI, LTD. (1)
* 4764804 Semiconductor device and process for producing the same 139 1987
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
7230273 Semiconductor device with a plurality of semiconductor elements each including a wide band-gap semiconductor 8 2003
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED (1)
* 8450152 Double-side exposed semiconductor device and its manufacturing method 0 2011
* Cited By Examiner

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