METHODS AND ARRANGEMENT FOR DETECTING A WAFER-RELEASED EVENT WITHIN A PLASMA PROCESSING CHAMBER
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United States of America Patent
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Issued Date -
Mar 10, 2011
app pub date -
Sep 10, 2009
filing date -
Sep 10, 2009
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Abstract
A method for identifying an optimal time for mechanically removing a substrate from a lower electrode in a processing chamber of a plasma processing system is provided. The method includes employing a set of sensors to monitor a set of electrical characteristics of a plasma, wherein the plasma is formed over the substrate during a dechuck event. The method also includes sending processing data about the set of electrical characteristics to a data collection device. The method further includes comparing the processing data against a set of threshold values. The method yet also includes, if the processing data traverses the threshold values, removing the substrate from the lower electrode since a substrate-released event has occurred.
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