INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Mar 17, 2011
app pub date -
Sep 17, 2009
filing date -
Sep 17, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base package substrate; mounting a flip chip integrated circuit die on the base package substrate; applying a flip chip protective layer on the flip chip integrated circuit die including covering only a back side of the flip chip integrated circuit die; and mounting an upper package on the base package substrate including positioning an upper package substrate adjacent to the flip chip protective layer.
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