Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module

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United States of America Patent

PATENT NO 8305699
APP PUB NO 20110069216A1
SERIAL NO

12873461

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Abstract

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A wafer-level lens module with an extended depth of field (EDF) and an imaging device including the wafer-level lens module are provided. The wafer-level EDF lens module includes a plurality of wafer-scale lenses stacked with fixed distances therebetween. The plurality of wafer-scale lenses includes an effective lens having a profile which satisfies a corrected optimized aspheric function, wherein a profile of a center region of the effective lens is optimized for an infinity-focused image and a profile of an edge region of the effective lens is optimized for a macro-focused image.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Woon-Bae Seoul, KR 90 1192
Lee, Jeong-Yub Seoul, KR 24 282
Lee, Seung-Wan Suwon-si, KR 56 813

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