SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
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United States of America Patent
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app pub date -
Dec 3, 2010
filing date -
Jun 8, 2006
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Abstract
A semiconductor device and methods of fabricating the same, wherein insulation layers are interposed to sequentially dispose the semiconductor device on a semiconductor substrate. The semiconductor device includes a first conductive plate, a second conductive plate, a third conductive plate, and a fourth conductive plate. At least two of the first, second, third and fourth conductive plates are electrically connected and constitute at least two capacitors.
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