Guide Chip Structure for High-Frequency Induction Heating Coil
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United States of America Patent
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N/A
Issued Date -
Mar 31, 2011
app pub date -
Jul 17, 2008
filing date -
Jul 17, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
To provide a structure of guide chips for high frequency induction heating coil which makes it possible to correctly position the guide chips for high frequency induction heating coil in the width direction of a journal portion or a pin portion of a crankshaft and which thus makes it possible to correctly position a semi-open saddle type high frequency induction heating coil in the width direction of the journal portion or the pin portion. is reduced or eliminated by the spring function of the pair of flexible bodies.
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