HIGH THERMAL CONDUCTIVITY AND LOW DISSIPATION FACTOR ADHESIVE VARNISH FOR BUILD-UP ADDITIONAL INSULATION LAYERS
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United States of America Patent
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Issued Date -
Mar 31, 2011
app pub date -
Sep 25, 2009
filing date -
Sep 25, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A high thermal conductivity and low dissipation factor adhesive varnish for (build-up) combining additional insulation layers is disclosed to be used for high-density interconnected printed circuit boards or IC-package substrates and to be formed by well mixing an epoxy resin precursor, a bi-hardener mixture, a catalyst, a flow modifier, an inorganic filler with high thermal conductivity, and a solvent. The epoxy resin precursor is formed by mixing at least two epoxy resins with a certain ratio, where the at least two epoxy resins are selected from a group including a tri-functional epoxy resin, a rubber-modified or Dimmer-acid-modified epoxy resin, a bromide-contained epoxy resin, a halogen-free/phosphorus-contained epoxy resin, a halogen-free/phosphorus-free epoxy resin, a long-chain/halogen-free epoxy resin, and a bisphenol A (BPA) epoxy resin.
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