Semiconductor integrated circuit
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United States of America Patent
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Mar 11, 2014
Grant Date -
Mar 31, 2011
app pub date -
Dec 8, 2010
filing date -
Jun 10, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor integrated circuit according to the present invention includes an I/O cell, a first PAD connected to the I/O cell, first and second PADs, a package wire which is connected to the first PAD and allows connection between the first PAD and an outside of the semiconductor integrated circuit, and a second package wire which is connected to the second PAD and allows connection between the second PAD and an outside of the semiconductor integrated circuit. A connection point between the first PAD and the fist package wire is located in an area where the I/O cell is placed. A connection point between the second PAD and the second package wire is located outside an area where the I/O cell is placed.
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