Assemblies and Methods for Sensing Current Through Semiconductor Device Leads
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United States of America Patent
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Issued Date -
Mar 31, 2011
app pub date -
Sep 29, 2009
filing date -
Sep 29, 2009
priority date (Note) -
Abandoned
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Abstract
Assemblies and methods for sensing current through semiconductor device leads are disclosed. One example method includes mounting a current sense assembly about a lead of a semiconductor device. The current sense assembly may include a carrier adapted to hold a current sensor in close proximity to a semiconductor device lead to sense current flowing in the lead. One example assembly for sensing current through a semiconductor device lead includes a carrier for mounting to the semiconductor device lead and a current sensor supported by the carrier. The carrier includes output terminals. The current sensor has leads electrically coupled to the output terminals. The current sensor is positioned to extend around at least a portion of the lead and provide a signal to the output terminals representing current flowing in the lead when the carrier is mounted to the lead.
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