SYSTEM FOR REDUCING METALLIC WHISKER FORMATION
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United States of America Patent
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Issued Date -
Apr 7, 2011
app pub date -
Sep 30, 2010
filing date -
Oct 7, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed is a whisker-formation resistant composition that is suitable for use as a lead-free soldering composition. The composition includes a fusible material and a matrix material that is aggregated with the fusible material. Typically the fusible material has a lower melting temperature than the melting temperature of the matrix material and has a coefficient of thermal expansion that is higher than the coefficient of thermal expansion of the matrix material. Also provided is a method of reducing the formation of whiskers adjacent solder that bridges a joint. The method includes the step of melting a fusible material adjacent the joint. A further step is solidifying the fusible material while establishing a static tensile stress tendency in the fusible material.
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