Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
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United States of America Patent
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Nov 19, 2013
Grant Date -
Apr 14, 2011
app pub date -
Jun 10, 2008
filing date -
Mar 21, 2008
priority date (Note) -
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Abstract
The invention provides a photosensitive resin composition comprising (A) 100 parts by weight of a binder polymer having 10-65 parts by weight of a divalent group obtained from a specific styrene compound and its derivative, 5-55 parts by weight of a divalent group obtained from a specific (meth)acrylic acid ester and its derivative and 15-50 parts by weight of a divalent group obtained from (meth)acrylic acid, (B) a photopolymerizing compound and (C) a photopolymerization initiator.
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