Arrangement Structure of Guide Chip for High-Frequency Induction Heating Coil

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110089167A1
SERIAL NO

12995205

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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To provide an arrangement structure of guide chips for high frequency induction heating coil, which structure is capable of correctly positioning the center of a journal portion or a pin portion of a crankshaft, and thereby capable of uniformly applying high frequency induction heating to the journal portion or the pin portion so as to make a hardened case uniform, and which structure is capable of performing the high frequency induction heating and hardening comparatively simply and inexpensively. An upper side guide chip 21a for high frequency induction heating coil is attached to a side plate 7 in a fixed state, and at least one of left and right side guide chips 21b and 21c for high frequency induction heating coil is arranged in the side plate 7 so as to be movable along the radial direction of a journal portion 2 or a pin portion 4. The dimension between the distal end portions of the left and right side guide chips 21b and 21c for high frequency induction heating coil is set to become smaller than the outside diameter dimension of the journal portion 2 or the pin portion 4 in a free state in which the three guide chips 21a, 21b and 21c for high frequency induction heating coil are not brought into contact with the journal portion 2 or the pin portion 4.

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Patent Owner(s)

Patent OwnerAddress
DENKI KOGYO CO LTDTOKYO 100

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sawatsubashi, Seiichi Tokyo, JP 3 0

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