Chip Lead Frame and Photoelectric Energy Transducing Module
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United States of America Patent
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Issued Date -
Apr 21, 2011
app pub date -
Oct 6, 2010
filing date -
Oct 16, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention discloses a chip lead frame and a photoelectric energy transducing module. The chip lead frame includes an insulator and a plurality of conductors. The insulator includes a first surface, a second surface, a first recess structure formed on the first surface, a through hole passing through the second surface and the first recess structure, and a venting structure. The first recess structure forms an accommodating space. The venting structure communicates with the accommodating space so that when a substrate is being bound to the first recess structure, the air in the accommodating space pressed by the substrate could flow through the venting structure out of the insulator without remaining between the substrate and the first recess structure. A photoelectric energy transducing semiconductor structure could be disposed on the substrate and electrically connected to the conductors, so as to form the photoelectric energy transducing module of the invention.
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