Interposer Based Monolithic Microwave Integrate Circuit (iMMIC)
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United States of America Patent
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Issued Date -
Apr 21, 2011
app pub date -
Oct 1, 2010
filing date -
Oct 16, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system is disclosed for IC fabrication, including seating an integrated circuit (“IC”) having at least one contact into a recess of a silicon interposer substrate, applying an insulator in liquid form to fill portions of the recess not otherwise occupied by the IC and to cover a top surface of the IC and the silicon interposer substrate, introducing the insulator to a ramped environmental temperature, holding the environmental temperature at a reflow temperature to reflow the insulator and ramping down the environmental temperature to cure the insulator.
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