METHOD FOR PRODUCING PERFORATED OR PARTIALLY PERFORATED STENCILS WITH A RELIEF

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United States of America Patent

SERIAL NO

12917096

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for producing a stencil, which has on its upper side a relief with a multiplicity of openings, the contours of which correspond to a desired pattern, and to a stencil of this type. In order to permit greater relief heights, and consequently increased freedom of design of patterns to be applied, the stencil is provided with a body having at least one non-perforated non-metal relief layer. The material of the relief layer is removed according to the pattern by laser or plasma radiation to form the multiplicity of openings of the relief. Through-openings which extend to a rear side opposite from the upper side are provided at least in the bottom region of the openings of the relief. A stencil with a stencil body (10) may be obtained, which has at least one non-metal relief layer, formed in the upper side of which is a relief with a multiplicity of openings, the contours of which correspond to a desired pattern. Through-openings which extend to a rear side opposite from the upper side are provided here at least in the bottom region of the openings of the relief.

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Patent Owner(s)

Patent OwnerAddress
SPGPRINTS AUSTRIA GMBH6336 LANGKAMPFEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Juffinger, Josef Thiersee, AT 11 188
Wefers, Lothar Oberaudorf, DE 5 16

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