COOLING ARRANGEMENT
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United States of America Patent
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Issued Date -
May 5, 2011
app pub date -
Nov 1, 2010
filing date -
Oct 30, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to an arrangement for cooling at least one electrical and/or electronic component and/or group of electrical/electronic components by means of a cooling body. The cooling body demonstrates at least one recess into which the electrical/electronic component and/or the group of electrical/electronic components to be cooled can be inserted. Introduced into the recess of the cooling body is a medium, which nearly completely surrounds the at least one electrical/electronic component and/or the group of electrical/electronic components in their state of insertion into the recess.
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