SUBSTRATE-MOUNTED CIRCUIT MODULE HAVING COMPONENTS IN A PLURALITY OF CONTACTING PLANES
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United States of America Patent
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Issued Date -
May 5, 2011
app pub date -
Apr 2, 2009
filing date -
Apr 28, 2008
priority date (Note) -
Abandoned
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Abstract
In a circuit module having components that are fastened to a substrate, the substrate includes a carrier layer made of metal and having a first surface, a first insulating layer bordering directly on the carrier layer being situated on the first surface. The substrate also includes a first wiring layer bordering directly on the first insulating layer, which conducts electrically and is situated on the first insulating layer. The substrate includes a first contact plane, which runs along the first surface, at least one of the components being directly connected electrically to the carrier layer in the first contact plane.
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