INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
May 12, 2011
app pub date -
Mar 23, 2010
filing date -
Nov 11, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a conductive layer having a first surface and a second surface; forming first concave trenches in the first surface of the conductive layer and the first concave trenches are connected by a first flat region of the first surface; connecting an integrated circuit to the first flat region with a conductive interconnect; encapsulating the integrated circuit with an encapsulation that fills the first concave trenches; and forming second concave trenches having a similar size in the second surface of the conductive layer with the second concave trenches connected by a second flat region that is larger than the first flat region, and the second concave trenches are formed through the conductive layer to expose the encapsulation.
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