EXTENDED UNDER-BUMP METAL LAYER FOR BLOCKING ALPHA PARTICLES IN A SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
May 26, 2011
app pub date -
Nov 23, 2009
filing date -
Nov 23, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An integrated circuit (IC) has an under-bump metal (UBM) pad disposed between a solder bump and a semiconductor portion of the IC. The UBM pad has a contact perimeter formed with the solder bump. The UBM pad extends beyond the contact perimeter a sufficient distance to block alpha particles emitted from the surface of the solder bump from causing an upset event in the semiconductor portion.
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