Ceramic substrate preparation process
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United States of America Patent
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Issued Date -
May 26, 2011
app pub date -
Jul 9, 2010
filing date -
Nov 20, 2009
priority date (Note) -
Abandoned
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Abstract
An etching-free ceramic substrate preparation process includes the step of bonding a dry film to one side of a ceramic plate, the step of applying an exposing and developing process to the dry film to form a predetermined circuit layout on the dry film, the step of coating a thin-thickness first metal layer on the ceramic plate and the dry film, the step of forming a copper layer on the first metal layer by a coating technique, the step of cutting/grinding the dry film, the first metal layer and the copper layer to remove the dry film from the ceramic plate, the step of obtaining the desired height of the copper layer on the ceramic plate, and the step of forming a second metal layer on the surface of the copper layer by a coating technique.
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