High-precision ceramic substrate preparation process
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United States of America Patent
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Issued Date -
May 26, 2011
app pub date -
Aug 17, 2010
filing date -
Nov 20, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A high-precision ceramic substrate preparation process is disclosed to bond a dry film to a metal layer on a ceramic plate, and then to coat a conductive layer on the metal layer and an anti-etching metal layer on the conductive layer after application of an exposing and developing process to form a predetermined circuit pattern in the dry film, and then to remove the dry film and to etch the metal layer, and then to bond an oxygen-free tape, which is prepared from a compound of ceramic powder, glass powder and pasting agent, to the conductive layer, and then to sinter the oxygen-free tape in an oxygen-free sintering furnace into a retaining wall, and then to coat an anti-oxidation bonding layer on the surface of the conductive layer.
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