Electronic Substrate Having Low Current Leakage and High Thermal Conductivity and Associated Methods

United States of America Patent

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Issued Date
Jun 2, 2011
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May 25, 2010
filing date
Jul 23, 2009

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Patent Owner	Address
RITEDIA CORPORATION	NO 17 KUANGFU N ROAD HSIN CHU INDUSTRIAL PARK HUKOU TOWNSHIP HSINCHU COUNTY 303

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Inventor Name	Address	# of filed Patents	Total Citations
Hu, Shao Chung	Xindian City, TW	16	92
Kan, Ming Chi	Rende Township, TW	3	23
Sung, Chien-Min	US	267	5186

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Electronic Substrate Having Low Current Leakage and High Thermal Conductivity and Associated Methods

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12787074

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APP PUB NO	20110127562A1
SERIAL NO	12787074
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12787074

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