SELECTIVE SOLDERING APPARATUS AND A METHOD OF PUMPING SOLDER IN A SELECTIVE SOLDERING APPARATUS
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United States of America Patent
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Issued Date -
Jun 9, 2011
app pub date -
Aug 22, 2008
filing date -
Aug 28, 2007
priority date (Note) -
Abandoned
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Abstract
An impeller type pump (7) in a selective soldering apparatus (1) is positioned so that the surface (S) level of molten solder in the bath adjacent the impeller axle (31) is just below the upper edge (53) of the impeller blades (41). This can reduce the formation of solder dust.
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