METHODS AND APPARATUS FOR ENHANCED FREQUENCY RESPONSE OF MAGNETIC SENSORS
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United States of America Patent
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Issued Date -
Jun 9, 2011
app pub date -
Dec 3, 2009
filing date -
Dec 3, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Methods and apparatus for providing an integrated circuit package device, comprising a conductive leadframe, a magnetic sensor element disposed on the leadframe, wherein the leadframe includes a slot configuration to reduce eddy current flow about the magnetic sensor, the slot configuration including a first slot generally perpendicular to a second slot, wherein the first slot extends under the sensor element.
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