Thin multi-chip flex module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jun 16, 2011
app pub date -
Feb 17, 2011
filing date -
Jan 2, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.
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