BONDING METHOD AND RESIN MEMBER BONDED THEREBY
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United States of America Patent
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app pub date -
Feb 24, 2011
filing date -
Mar 26, 2004
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Abandoned
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Abstract
By performing thermal fusion bonding in the state where a bonding portion is covered with a bonding portion cover and the concentrations of oxygen and moisture inside the bonding portion cover are set lower than the concentrations of oxygen and moisture in the atmosphere, it is possible to reduce elution from a bonded resin-based pipe.
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