MICROELECTROMECHANICAL SENSOR DEVICE PACKAGE AND METHOD FOR MAKING THE SAME
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United States of America Patent
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Issued Date -
Jun 16, 2011
app pub date -
Jul 12, 2010
filing date -
Dec 14, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A microelectromechanical sensor device package includes a substrate, a microelectromechanical sensor device and a cap. The substrate has a surface on which a circuit pattern having a plurality of first conductive contacts is provided. The device is mounted on the surface of the substrate and has an active surface on which a plurality of second conductive contacts are provided. A plurality of bonding wires are used to electrically connect the first conductive contacts to the second conductive contacts respectively. The cap is made of an electrically insulating material and attached on the surface of the substrate in a way that the cap covers the microelectromechanical sensor device and a space is formed between the cap and the microelectromechanical sensor device.
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