Thermal Sensing for Material Processing Assemblies
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United States of America Patent
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Issued Date -
Jun 16, 2011
app pub date -
Jun 23, 2010
filing date -
Dec 15, 2009
priority date (Note) -
Abandoned
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Abstract
Various embodiments of thermal sensing systems and methods for monitoring thermal conditions in such material processing assemblies are described. The thermal sensing systems include a sensor cable that incorporates or is coupled to one or more thermal sensors. The sensor cable is positioned in the assembly and the thermal sensors provide temperature measurements. In various embodiments, the sensor cable and thermal sensors may be optical or electrical devices.
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