Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer
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United States of America Patent
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Nov 12, 2013
Grant Date -
Jun 30, 2011
app pub date -
Nov 9, 2005
filing date -
Dec 6, 2004
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Abstract
The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is used further in a semiconductor device into which the thinned semiconductor chip is to be incorporated.
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