Cooling system

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United States of America Patent

PATENT NO 8776542
APP PUB NO 20110155569A1
SERIAL NO

12975962

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Abstract

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A cooling system that cools a wafer in a vacuum chamber of a sputtering apparatus, includes a wafer cooling stage for cooling the wafer, a cooling mechanism for cooling the wafer cooling stage, cooling gas supply units which introduces a cooling gas to the wafer cooling stage, a wafer rotating mechanism which holds the wafer in a state separated from the wafer cooling stage by a predetermined gap, and is rotated while holding the wafer, and a driving mechanism which rotates the wafer rotating mechanism at a predetermined rotational speed.

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Patent Owner(s)

  • CANON ANELVA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abarra, Einstein Noel Hachioji, JP 42 172
Endo, Tetsuya Komae, JP 30 345

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