Dual Interconnection in Stacked Memory and Controller Module

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United States of America Patent

SERIAL NO

13051917

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Abstract

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A chip package transmitting slow speed signals via edge connectors and high speed signals by means of through-silicon-vias. The edge connectors are formed in recesses formed in the sidewalls of the package.

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Patent Owner(s)

Patent OwnerAddress
WAFER-LEVEL PACKAGING PORTFOLIO LLCCUPERTINO CA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Marcoux, Phil P Mountain View, US 12 1152

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