US Patent Application No: 2011/0176,254

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ELECTROCHEMICAL DEVICE

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Abstract

Provided is an electrochemical device applicable to high-temperature reflow soldering wherein a lead-free solder is used. An electric double layer capacitor (10) is provided with a capacitor element (11), a package (14) having the capacitor element (11) sealed therein, and a positive electrode terminal (12) and a negative electrode terminal (13), each of which is led out from the capacitor element and is provided with a part sealed in the package (14) with the capacitor element and other part led out to the outside the package. On a part of the positive electrode terminal (12) and on a part of the negative electrode terminal (13), increased thermal resistance sections (HR1) for suppressing heat transfer to the capacitor element (11) via the terminals (12, 13) from other parts of the positive electrode terminal (12) and other parts of the negative electrode terminal (13) are arranged, respectively.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TAIYO YUDEN CO., LTD.TOKYO686

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hagiwara, Naoto Gumma-gun, JP 25 71
Ishida, Katsuei Gunma, JP 15 5
YAWATA, Kazushi - 9 0

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