SPIRAL CONTACT AND PROCESS FOR PRODUCING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110177729A1
SERIAL NO

12092364

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

To provide a producing method of a spiral contact that exhibits, even in a hot environment, low permanent set in fatigue, excellent spring characteristic and excellent electrical conductivity. In the producing method in which atoms of a dissimilar metal are diffused and infiltrated into a surface layer of the spiral contact (7) by being heated in a state where the spiral contact (7) is brought into contact with the dissimilar metal, by heating titanium (or aluminum) deposited on the surface of the spiral contact, copper of a Cu substrate (1) and nickel which is a core material of the spiral contact (7), atoms of Ti (or Al) and atoms of Cu are diffused and infiltrated into the surface layer of the core material (Ni) to form alloys (7c) and (7d). The heating temperature is set such that a lower limit thereof is the temperature corresponding to 0.4 times the absolute temperature of the melting point of the metal with the highest melting point among the core metal and dissimilar metal brought in contact with each other while an upper limit thereof is the absolute temperature of the melting point of the metal with the lowest melting point among the core metal and dissimilar metal brought in contact with each other. Further, Ni (as a barrier material) is formed between the core material and the Cu substrate, and Cu is used as the core material.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ADVANCED SYSTEMS JAPAN INCTOKYO JAPAN TOKYO METROPOLIS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirai, Yukihiro Tokyo, JP 7 198

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation