CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
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United States of America Patent
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app pub date -
Aug 26, 2010
filing date -
Aug 6, 2009
priority date (Note) -
Abandoned
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Abstract
The present invention provides a conductor package structure comprising an optical sensor element. A filling material is filled around the optical sensor element. At least one conductor element is formed through the filling material from top side to the back side for signal connection. A redistribution layer is formed on the at least one conductor element and coupled to die pad of the optical sensor element. A transparent material is formed on the redistribution layer.
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