SEMICONDUCTOR CHIP, SEAL-RING STRUCTURE AND MANUFACTURING PROCESS THEREOF
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United States of America Patent
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Issued Date -
Jul 28, 2011
app pub date -
Jan 26, 2010
filing date -
Oct 2, 2009
priority date (Note) -
Abandoned
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Abstract
A semiconductor chip includes an integrated circuit region, at least one alignment indicator region and a seal-ring. The alignment indicator region is disposed near the integrated circuit region. The seal-ring surrounding the integrated circuit region is disposed outside of the integrated circuit region, and is formed as a mark for alignment on the alignment indicator region at a corner of the semiconductor chip. A manufacturing process of the seal-ring structure is also disclosed.
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