SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Aug 4, 2011
app pub date -
Jan 18, 2011
filing date -
Jan 29, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor device includes a bonding option pad, an internal power supply, and a MOS transistor. The bonding option pad is selectively wire-bonded to two voltage supply portions through which external power supply voltages with different power supply potentials are supplied from an external power supply. The internal power supply is caused to generate a pre-specified internal power supply voltage. The MOS transistor stabilizes an output level of the internal power supply voltage. The source and drain of the MOS transistor are shorted together and connected to the bonding option pad, and the gate there.
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