METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Aug 18, 2011
app pub date -
Jan 28, 2011
filing date -
Feb 17, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of manufacturing a semiconductor device includes preparing a flexible printed wiring board having a first connection pad formed on a front surface, a second connection pad formed on a back surface, and a coating film covering regions of the flexible printed wiring board where the first and second connection pads are formed, and a semiconductor package having a third connection pad formed on a hack surface; mounting the semiconductor package on the front surface of the flexible printed wiring board so that the third connection pad is connected to the first connection pad; and folding the flexible printed wiring board so that the second connection pad is located above the front surface of the semiconductor package to face in the same direction as a front surface of the semiconductor package.
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