Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame
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United States of America Patent
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app pub date -
Apr 30, 2011
filing date -
May 18, 2009
priority date (Note) -
Abandoned
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Abstract
A semiconductor device is made by mounting a semiconductor component over a carrier. A ferromagnetic inductor core is formed over the carrier. A pillar frame including a plurality of bodies is mounted over the carrier, semiconductor component, and inductor core. An encapsulant is deposited around the semiconductor component, plurality of bodies, and inductor core. A portion of the pillar frame is removed. A first remaining portion of the pillar frame bodies provide inductor pillars around the inductor core and a second remaining portion of the pillar frame bodies provide an interconnect pillar. A first interconnect structure is formed over a first surface of the encapsulant. The carrier is removed. A second interconnect structure is formed over a second surface of the encapsulant. The first and second interconnect structures are electrically connected to the inductor pillars to form one or more 3D inductors.
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