SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110207281A1
SERIAL NO

13023775

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Abstract

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A method of producing a semiconductor device includes the steps of forming a trench in a semiconductor substrate of a first conductive type so that an active region having a first portion and a second region is formed; implanting a first impurity of the first conductive type at an implantation angle between 30 degrees and 45 degrees relative to a normal line in an implantation direction rotating relative to the normal line so that a first channel diffusion region and a channel stopper region of the first conductive type are formed; filling the trench with an insulation layer; implanting a second impurity of a second conductive type so that a second channel diffusion region of the second conductive type is formed; forming a gate insulation film on the first portion and the second portion; and forming a gate electrode on the gate insulation film.

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Patent Owner(s)

Patent OwnerAddress
OKI SEMICONDUCTOR CO LTD550-1 HIGASHIASAKAWA-CHO HACHIOJI-SHI TOKYO 193-8550

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KAMOSHITA, Junichi Miyagi, JP 2 10

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