METHODS FOR MEMORY PROGRAMMING DURING PRODUCT ASSEMBLY
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United States of America Patent
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Issued Date -
Aug 25, 2011
app pub date -
Feb 22, 2010
filing date -
Feb 22, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of writing data to an electronic device during assembly comprises attaching a resident memory element to one or more contact pads of a circuit board using a solder paste; reflowing the solder paste to affix the resident memory element to the contact pads; copying data from an external memory element to the resident memory element; and thereafter combining a device component with the circuit board to at least partially complete assembly of the electronic device.
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