METHOD FOR DETACHING WAFERS FROM A WAFER CARRIER AND DEVICE FOR THIS PURPOSE
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United States of America Patent
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app pub date -
Apr 15, 2011
filing date -
Oct 15, 2008
priority date (Note) -
Abandoned
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Abstract
In a method for detaching wafers from a carrier unit, the wafers being formed by sawing a wafer block fastened to the carrier unit by gluing, and the wafers themselves still being glued on one side, the carrier unit with the wafers is introduced into an ungluing unit along a uniform movement plane. It remains therein and is enclosed in an ungluing basin by movable wall parts. Solvent for ungluing is applied into the ungluing basin and onto the wafers after the formation and closing of the ungluing basin to dissolve the glued bond and subsequently detach the wafers from the carrier unit.
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