Method for Protecting Optical Devices During Manufacture
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United States of America Patent
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Issued Date -
Sep 1, 2011
app pub date -
Jan 25, 2011
filing date -
Jan 25, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
This disclosure regards methods for protecting a die during shaping and polishing of optical devices. According to various embodiments, layers can be added and removed from a wafer to protect both sides of the wafer during various steps of a manufacturing process.
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