MANUFACTURING OF INTEGRATED CIRCUIT DEVICES USING A GLOBAL PREDICTIVE MONITORING SYSTEM
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United States of America Patent
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app pub date -
Feb 22, 2011
filing date -
Sep 22, 2006
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Abandoned
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Abstract
A global predictive monitoring system for a manufacturing facility. The system may be employed in an integrated circuit (IC) device fabrication facility to monitor processing of semiconductor wafers. The system may include deployment of a swarm of individually separate agents running in computers in the facility. Each agent may comprise a genetic algorithm and use several neural networks for computation. Each agent may be configured to receive a limited set of inputs, such as defectivity data and WIP information, and calculate a risk from the inputs. A risk may be a value indicative of a production yield. Each agent may also generate a quality value indicative of a reliability of the risk value. New agents may be generated from the initial population of agents. Outputs from the agents may be collected and used to calculate projections indicative of a trend of the production yield.
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