SIDE PACKAGED TYPE PRINTED CIRCUIT BOARD
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United States of America Patent
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N/A
Issued Date -
Sep 15, 2011
app pub date -
Apr 16, 2010
filing date -
Mar 9, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention provides a side packaged type printed circuit board. The side packaged type printed circuit board includes a circuit substrate having a surface and an adjacent side surface. An inner circuit covers a portion of the surface. A first side electrical connecting pad electrically connects to the inner circuit, wherein the first side electrical connecting pad and the inner circuit are in the same additional layer.
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