Semiconductor device having low parasitic resistance and small junction leakage characteristic and method of manufacturing the same

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United States of America Patent

SERIAL NO

13067214

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Abstract

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A semiconductor device includes diffusion layers formed in a SOI layer under a side-wall, a channel formed between the diffusion layers, silicide layers sandwiching the diffusion layers wherein interface junctions between the diffusion layers and the silicide layers are (111) silicon planes.

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Patent Owner(s)

Patent OwnerAddress
LAPIS SEMICONDUCTOR CO LTD2-4-8 SHINYOKOHAMA KOUHOKU-KU YOKOHAMA-SHI KANAGAWA 222-8575

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirashita, Norio Tokyo, JP 14 133
Ichimori, Takashi Tokyo, JP 14 80

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