THERMALLY CONDUCTIVE INTERFACE MEANS
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United States of America Patent
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Issued Date -
Sep 22, 2011
app pub date -
Mar 19, 2010
filing date -
Mar 19, 2010
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Abstract
A highly thermally conductive interface means comprises a plurality of non-particulate solid components and a liquid bonding paste. The non-particulate solid components are made of high heat-conducting materials and dispersedly disposed on interfaces between heat sources and heat sinks. The liquid bonding paste is applied on interfaces between heat sources and heat sinks and filled into gaps formed among each of said non-particulate solid components so that the heat sources, heat sinks and each of said non-particulate solid components are bonded together.
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