WAFER LEVEL PACKAGING WITH HEAT DISSIPATION
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United States of America Patent
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Issued Date -
Sep 29, 2011
app pub date -
Mar 24, 2010
filing date -
Mar 24, 2010
priority date (Note) -
Abandoned
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Abstract
A heat dissipating wafer level package and method for manufacturing a heat dissipating wafer level package is provided. The heat dissipating wafer level package has a thermally conductive coating integrated thereon which facilitates the dissipation of heat from a device into the surrounding air and/or the thermal transfer of heat away from the device toward a heat spreader or heat sink. Additionally, the coating enhances the structural integrity and strength of the wafer during the manufacturing process as well as the resulting WLP.
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