Mold and substrate for use with mold

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8198143
APP PUB NO 20110244637A1
SERIAL NO

13097066

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A mold (10) including a first mold part (12) and a second mold part (14) define a mold cavity (16) therebetween. A gate (18) is formed in at least one of the first and second mold parts (12) and (14) such that the gate (18) communicates with the mold cavity (16). A vent (20) having a constricted portion (22) is arranged to communicate with the mold cavity (16). A substrate (28) including a base substrate (30) and an electrically conductive pattern (32) and (34) formed on the base substrate (30) may be received in the mold (10). A solder resist layer (36) is formed on the base substrate (30) and a portion of the electrically conductive pattern (32). A plurality of grooves (38) and (40) is formed in a staggered arrangement around a periphery of a molding area (42) on the substrate (28).

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
SHENZHEN XINGUODU TECHNOLOGY CO LTD17TH FLOOR JINSONG MANSION TERRA INDUSTRIAL & TRADE PARK FUTIAN SHENZHEN

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eu, Poh Leng Petaling Jaya, MY 26 94
Low, Boon Yew Petaling Jaya, MY 31 119
Wong, Wai Keong Shah Alam, MY 12 49

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation